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Amkor Chip scale BGA		Flipchip Technologies	AVX Corp Transient voltage suppression	Surplus Record Machinery & Equipment Trade Show	Lyondell
Yamaichi Electronics		Philips Parallel processing	ASAT TBGA’s	Capital Electro-Circuits PC Boards	American Technical Ceramics
General Production Devices Testers & Cleaners		Indium	Nordson Selective flux dot coating	International Paper	NTK Technical Ceramics
Ansoft Signal integrity solutions	WYKO Bump measurement	NAS Interplex Solder & Flux bearing leads	Johnson Matthey Electronics	Rohm QFP/TQFP/SOP/SSOP	Asymtek
ProLinx Labs	Nordson	Dexter Electronic Materials Flip chip Encapsulants		Palomar Products	Leica
August Technology		Quantum Materials		Hana Technologies PBGA technology		Hyundai
Analysis Tech	Veeco Process metrology	Carlo Gavazzi Multilayer & double-sided PCB fab facility	IS Meca High speed component handling	Heraeus Research, Industrial & Medical	Quad Systems Electronic Assembly Process & Productivity Solutions
NTK Technical Ceramics	Weyerhauser		Nextek Inc. Advanced analytical services	Dupont Wireless communication devices	Ultron Systems Eutectic & Epoxy bonders
Smart Sonic Corporation SMT stensil cleaning systems		Royce Instruments Bond test & die handling equipment		Hammermill

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